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1

Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling

Zhou, Quan, Zhou, Bite, Lee, Tae-Kyu, Bieler, Thomas

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 6.34 MB

english, 2016

2

Electromigration and Thermomechanical Fatigue Behavior of Sn0.3Ag0.7Cu Solder Joints

Zuo, Yong, Bieler, Thomas R., Zhou, Quan, Ma, Limin, Guo, Fu

Journal:

Journal of Electronic Materials

Year:

2018

Language:

english

File:

PDF, 9.44 MB

english, 2018

3

Foreword: Structural Transitions and Local Deformation Processes at and Near Grain Boundaries

Thomas R. Bieler, Rozaliya Barabash, Stephen W. Banovic

Journal:

Metallurgical and Materials Transactions A

Year:

2011

Language:

english

File:

PDF, 92 KB

english, 2011

4

The 11th MPMD Global Innovations Symposium: Global innovations in manufacturing of aerospace materials

Deborah D. Whitis, Thomas R. Bieler, Michael P. Miles

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

2010

File:

PDF, 818 KB

2010

5

Multiscale Modeling of the Effect of Micro-alloying Mn and Sb on the Viscoplastic Response of SAC105 Solder

Mukherjee, Subhasis, Dasgupta, Abhijit, Zhou, Bite, Bieler, Thomas R.

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 3.49 MB

english, 2014

6

Grain Boundary Responses to Heterogeneous Deformation in Tantalum Polycrystals

Bieler, Thomas R., Sutton, Scott C., Dunlap, Bret E., Keith, Zackery A., Eisenlohr, Philip, Crimp, Martin A., Boyce, Brad L.

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

2014

Language:

english

File:

PDF, 1.12 MB

english, 2014

7

Influence of High-GMechanical Shock and Thermal Cycling on Localized Recrystallization in Sn-Ag-Cu Solder Interconnects

Lee, Tae-Kyu, Kim, Choong-Un, Bieler, Thomas R.

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 1.81 MB

english, 2014

8

Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications

Zhou, Bite, Muralidharan, Govindarajan, Kurumadalli, Kanth, Parish, Chad M., Leslie, Scott, Bieler, Thomas R.

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 1.49 MB

english, 2014

9

The Effect of Cooling Rate on Grain Orientation and Misorientation Microstructure of SAC105 Solder Joints Before and After Impact Drop Tests

Darbandi, Payam, Bieler, Thomas R., Pourboghrat, Farhang, Lee, Tae-kyu

Journal:

Journal of Electronic Materials

Year:

2014

Language:

english

File:

PDF, 3.97 MB

english, 2014

10

Analysis of the Deformation Behavior in Tension and Tension-Creep of Ti-3Al-2.5V (wt pct) at 296 K and 728 K (23 °C and 455 °C) Using In Situ SEM Experiments

Li, Hongmei, Boehlert, Carl J., Bieler, Thomas R., Crimp, Martin A.

Journal:

Metallurgical and Materials Transactions A

Year:

2014

Language:

english

File:

PDF, 2.93 MB

english, 2014

11

Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages

Zhou, Bite, Zhou, Quan, Bieler, Thomas R., Lee, Tae-kyu

Journal:

Journal of Electronic Materials

Year:

2015

Language:

english

File:

PDF, 12.31 MB

english, 2015

12

Phase Dependent Tool Wear in Turning Ti-6Al-4V Using Polycrystalline Diamond and Carbide Inserts

Schrock, David J., Kang, Di, Bieler, Thomas R., Kwon, Patrick

Journal:

Journal of Manufacturing Science and Engineering

Year:

2014

Language:

english

File:

PDF, 5.83 MB

english, 2014

13

Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal Cycling in Sn-Ag-Cu Solder Interconnects

Lee, Tae-Kyu, Bieler, Thomas R., Kim, Choong-Un

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 3.71 MB

english, 2016

14

Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

Lee, Tae-Kyu, Chen, Zhiqiang, Baty, Greg, Bieler, Thomas R., Kim, Choong-Un

Journal:

Journal of Electronic Materials

Year:

2016

Language:

english

File:

PDF, 2.30 MB

english, 2016

15

The Origin of Flank Wear in Turning Ti-6Al-4V

Nguyen, Trung, Kwon, Patrick, Kang, Di, Bieler, Thomas R.

Journal:

Journal of Manufacturing Science and Engineering

Year:

2016

Language:

english

File:

PDF, 5.74 MB

english, 2016

16

Crystal Plasticity Finite Element Methods (In Materials Science and Engineering) || Front Matter

Roters, Franz, Eisenlohr, Philip, Bieler, Thomas R., Raabe, Dierk

Year:

2010

Language:

english

File:

PDF, 87 KB

english, 2010

17

Subsurface Grain Morphology Reconstruction by Differential Aperture X-ray Microscopy

Philip Eisenlohr,Pratheek Shanthraj,Brendan R. Vande Kieft,Thomas R. Bieler…

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

2017

Language:

english

File:

PDF, 1.12 MB

english, 2017

18

AIP Conference Proceedings [AIP Publishing LLC SCIENCE AND TECHNOLOGY OF INGOT NIOBIUM FOR SUPERCONDUCTING RADIO FREQUENCY APPLICATIONS - Virginia, USA (4 December 2015)] - Deformation mechanisms, defects, heat treatment, and thermal conductivity in large grain niobium

Bieler, Thomas R., Kang, Di, Baars, Derek C., Chandrasekaran, Saravan, Mapar, Aboozar, Ciovati, Gianluigi, Wright, Neil T., Pourboghrat, Farhang, Murphy, James E., Compton, Chris C., Myneni, Ganapati

Year:

2015

Language:

english

File:

PDF, 16.77 MB

english, 2015

19

Status and future developments of the wake field transformer experiment

Thomas Weiland, Norbert Holtkamp, Petra Schütt, Rainer Wanzenberg, Wilhelm Bialowons, Michael Bieler, Hans-Christoph Lewin, Franz-Josef Decker

Journal:

Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Year:

1990

Language:

english

File:

PDF, 667 KB

english, 1990

20

The effects of HIP pore closure and age hardening on primary creep and tensile property variations in a TiAl XD™ alloy with 0.1 wt.% carbon

Raymond J. Simpkins II, Michael P. Rourke, Thomas R. Bieler, P.A. McQuay

Journal:

Materials Science and Engineering: A

Year:

2007

Language:

english

File:

PDF, 1.78 MB

english, 2007

21

Back-stress distribution along a thin twin layer in TiAl

Zhe Jin, Thomas R. Bieler

Journal:

Materials Science and Engineering: A

Year:

1995

Language:

english

File:

PDF, 546 KB

english, 1995

22

Preface

Judy Schneider, Rajiv S. Mishra, Thomas R. Bieler, Yuntian T. Zhu, Khaled B. Morsi, Viola L. Acoff, Eric M. Taleff, Ruslan Valiev

Journal:

Materials Science and Engineering: A

Year:

2007

Language:

english

File:

PDF, 44 KB

english, 2007

23

The origins of heterogeneous deformation during primary hot working of Ti–6Al–4V

Thomas R Bieler, S.L Semiatin

Journal:

International Journal of Plasticity

Year:

2002

Language:

english

File:

PDF, 1.61 MB

english, 2002

24

Shear creep deformation in polysynthetically twinned (PST) Ti–47Al–2Nb–2Cr with 〈110〉 and 〈112〉 orientations

Dong Yi Seo, Chih Huei Wu, Thomas R. Bieler

Journal:

Materials Science and Engineering: A

Year:

1997

Language:

english

File:

PDF, 381 KB

english, 1997

25

Comprehensive proteomic and transcriptomic analysis reveals early induction of a protective anti-oxidative stress response by low-dose proteasome inhibition

Sven Bieler, Silke Meiners, Verena Stangl, Thomas Pohl, Karl Stangl

Journal:

Year:

2009

Language:

english

File:

PDF, 241 KB

english, 2009

26

An experimental and theoretical investigation of the effect of local colony orientations and misorientation on cavitation during hot working of Ti-6Al-4V

Thomas R. Bieler, P. D. Nicolaou, S. L. Semiatin

Journal:

Metallurgical and Materials Transactions A

Year:

2005

Language:

english

File:

PDF, 1.81 MB

english, 2005

27

Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints

Tae-Kyu Lee, Kuo-Chuan Liu, Thomas R. Bieler

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 1.20 MB

english, 2009

28

Analysis of Slip Behavior in a Single Shear Lap Lead-Free Solder Joint During Simple Shear at 25°C and 0.1/s

Thomas R. Bieler, Adwait U. Telang

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 632 KB

english, 2009

29

Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear

Bite Zhou, Thomas R. Bieler, Tae-Kyu Lee, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 784 KB

english, 2009

30

Methodology for Analyzing Strain States DuringIn

Thomas R. Bieler, Tae-kyu Lee, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2009

Language:

english

File:

PDF, 838 KB

english, 2009

31

Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy

Tae-Kyu Lee, Bite Zhou, Lauren Blair, Kuo-Chuan Liu, Thomas R. Bieler

Journal:

Journal of Electronic Materials

Year:

2010

Language:

english

File:

PDF, 1.49 MB

english, 2010

32

Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface

Bite Zhou, Thomas R. Bieler, Tae-kyu Lee, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2010

Language:

english

File:

PDF, 1.50 MB

english, 2010

33

Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

Tae-Kyu Lee, Bo Liu, Bite Zhou, Thomas Bieler, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 1002 KB

english, 2011

34

Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects

Tae-Kyu Lee, Weidong Xie, Bite Zhou, Thomas Bieler, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 1.62 MB

english, 2011

35

Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation

Tae-Kyu Lee, Bite Zhou, Thomas Bieler, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 2.34 MB

english, 2012

36

In

Bite Zhou, Thomas R. Bieler, Guilin Wu, Stefan Zaefferer, Tae-Kyu Lee, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 968 KB

english, 2012

37

The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

Thomas R. Bieler, Bite Zhou, Lauren Blair, Amir Zamiri, Payam Darbandi, Farhang Pourboghrat, Tae-Kyu Lee, Kuo-Chuan Liu

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 2.73 MB

english, 2012

38

The hot deformation of aluminum alloys

Thomas R. Bieler, Lawrence A. Lalli, Stuart R. MacEwen

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

1998

Language:

english

File:

PDF, 276 KB

english, 1998

39

Numerical thermal mathematical model correlation to thermal balance test using adaptive particle swarm optimization (APSO)

T. Beck, A. Bieler, N. Thomas

Journal:

Applied Thermal Engineering

Year:

2012

Language:

english

File:

PDF, 1.01 MB

english, 2012

40

Acute oral toxicity: Variability, reliability, relevance and interspecies comparison of rodent LD50 data from literature surveyed for the ACuteTox project

Sebastian Hoffmann, Agnieszka Kinsner-Ovaskainen, Pilar Prieto, Inge Mangelsdorf, Christian Bieler, Thomas Cole

Journal:

Regulatory Toxicology and Pharmacology

Year:

2010

Language:

english

File:

PDF, 887 KB

english, 2010

41

Analysis of slip transfer and deformation behavior across the α/β interface in Ti–5Al–2.5Sn (wt.%) with an equiaxed microstructure

James R. Seal, Martin A. Crimp, Thomas R. Bieler, Carl J. Boehlert

Journal:

Materials Science and Engineering: A

Year:

2012

Language:

english

File:

PDF, 1.76 MB

english, 2012

42

The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance

Tae-Kyu Lee, Bite Zhou, Thomas R. Bieler, Chien-Fu Tseng, Jeng-Gong Duh

Journal:

Journal of Electronic Materials

Year:

2013

Language:

english

File:

PDF, 1.71 MB

english, 2013

43

Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD

Bite Zhou, Thomas R. Bieler, Tae-Kyu Lee, Wenjun Liu

Journal:

Journal of Electronic Materials

Year:

2013

Language:

english

File:

PDF, 3.63 MB

english, 2013

44

Mechanical Shaping of Metal Matrix Composites

Subramanian, K.N., Bieler, Thomas R., Lucas, J.P.

Journal:

Key Engineering Materials

Year:

1995

Language:

english

File:

PDF, 2.57 MB

english, 1995

45

Study of( { 11ar{2} 1} )Twinning inα-Ti by EBSD and Laue Microdiffraction

Leyun Wang, Rozaliya Barabash, Thomas Bieler…

Journal:

Metallurgical and Materials Transactions A

Year:

2013

Language:

english

File:

PDF, 1.14 MB

english, 2013

46

Foreword

Thomas R. Bieler, Rozaliya Barabash…

Journal:

Metallurgical and Materials Transactions A

Year:

2012

Language:

english

File:

PDF, 128 KB

english, 2012

47

Microstructural characterization of polycrystalline materials by synchrotron X-rays

Leyun Wang, Meimei Li, Jonathan Almer, Thomas Bieler…

Journal:

Frontiers of Materials Science

Year:

2013

Language:

english

File:

PDF, 891 KB

english, 2013

48

In SituCharacterization of Twin Nucleation in Pure Ti Using 3D-XRD

Bieler, Thomas R., Wang, Leyun, Beaudoin, Armand J., Kenesei, Peter, Lienert, Ulrich

Journal:

Metallurgical and Materials Transactions A

Year:

2014

Language:

english

File:

PDF, 1.24 MB

english, 2014

49

Crystal plasticity finite element study of deformation behavior in commonly observed microstructures in lead free solder joints

Darbandi, Payam, Lee, Tae-kyu, Bieler, Thomas R., Pourboghrat, Farhang

Journal:

Computational Materials Science

Year:

2014

Language:

english

File:

PDF, 3.61 MB

english, 2014

50

Optoelectronic phase delay measurement for a modified Michelson interferometer

Bruns, Thomas, Blume, Frank, Baaske, Kai, Bieler, Mark, Volkers, Henrik

Journal:

Year:

2013

Language:

english

File:

PDF, 483 KB

english, 2013

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